Xiaomi recently unveiled the 12 and 12 Pro in China with Snapdragon 8 Gen 1 chipsets and the new flagship is featured in a teardown video posted by WekiHome on YouTube. The teardown reveals that the 12 Pro’s build is very much “glass sandwich” structurally.
After breaking through the adhesive seal around the rear panel of the glass, we can see the layout of a main board and camera cluster towards the top, battery in the center, and the daughterboard at the bottom housing the charging part, speakers, and haptic motor.
Many of the connectors, modules, cameras, and links to the daughterboard need to be removed before the mainboard can come out. The Snapdragon 8 Gen 1 uses heat sink film, copper foil, silicone grease, and a large VC thermal plate measuring 2900 mm sq.
The 12 Pro is the first smartphone to arrive with the Sony IMX 707 50MP camera sensor and the auxiliary camera sensors include dual 50MP Samsung JN1 sensors. The main camera uses a 7-piece lens with OIS while the others include a telephoto lens made of 5 pieces and an ultrawide 6-piece lens. The front-facing camera is a 32MP shooter.
Both the RAM and Storage modules found onboard are manufactured by SK Hynix with LPDDR5 and UFS 3.1 standards, respectively. The teardown also found that the in-display scanner is made of a thinner, costlier assembly. Finally, the vibration motor is said to be comparable to that of the iPhone’s Taptic Engine.
The Xiaomi 12 Pro also has a 6.73-inch LTPO AMOLED screen. A 4,600 mAh battery is capable of 120W fast wired charging and 50W fast wireless charging.